Research on Interface Failure Mechanism and Reliability of Microelectronic Packaging

时间:2018-12-10浏览:99设置

Topic:Research on Interface Failure Mechanism and Reliability of Microelectronic Packaging

Speaker: Professor Liu Zhiquan

Event date: 12/10/201

Event time: 10:00 a.m.

Venue: Meeting Hall 606A, Building 12, Quanshan Campus

Sponsor: School of Mechanical and Electrical Engineering, Institute of Science and Technology




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