Prof. Zhang, master supervisor of School of Mechatronic Engineering, JSNU, is an academic leader of Jiangsu Innovation Project. He is also an executive member of Association of National New Material and Technology Development and a member of Youth Committee of Welding Association. Zhang is mainly engaged in the study of electronic interconnection material and technology. By far, he has published over 140 papers on academic journals, among which over 100 has been collected by SCI, EI. He has also hosted 12 projects at provincial or national level and been authorized 25 patents.
Research Interests
Electronic interconnection material and technology
Educational Background
PhD. Nanjing University of Aeronautics and Astronautics, 2006
MA. Nanchang Hangkong Univeristy, 2002
Research Projects in Recent Years
1. National Key R&D Plan(No. SQ2017yfgx010040, ¥15,000,000): Rare Metal WeldingInstallation of Conductive Material Preparation. 2016-2020
2. Jiangsu Six Talent Peaks Project (No. XCL-022, ¥40,000): Research on CNT-based 3D Packaging interconnection materials, 2017-2019
3. China Postdoctoral Science Foundation Funded Project (No. 2016M591464, ¥50,000): Research on 3D PackagingInterconnection Welding SpotReaction and Reliability. 2017-2019
Selected Publications
1. Zhang Liang, Tu K N. (2014). Structure and properties of lead-free solders bearing micro and nano particles. Materials Science & Engineering, 82:1-32.(SCI、EI)
2. Zhang Liang, Han Ji-guang, Guo Yonghuan, Sun Lei. (2014). Properties and microstructures of SnAgCu-xEu alloys for concentrator silicon solar cells solder layer. Solar Energy Materials and Solar Cells, 130:397-400. (SCI、EI)
3. Zhang Liang, Han Jiguang, Guo Yonghuan, He Chengwen.（2014）Properties enhancement of SnAgCu solders containing rare earth Yb. Materials and Design, 57:646-651.(SCI、EI)
4. Zhang Liang, Gao Lili. Interfacial compounds growth of SnAgCu(nano La2O3)/Cu solder joints based on experiments and FEM. Journal of Alloys and Compounds, 635:55-60. (SCI、EI)
5. Zhang Liang, Han Jiguang , Guo Yonghuan, He Chengwen. (2014). Effect of rare earth Ce on the fatigue life of SnAgCu solder joints in WLCSP device using FEM and experiments. Materials Science & Engineering, 597:219-224.(SCI、EI)
6. Zhang Liang, Cui Junhua, Han Ji-uang, He Chengwen, Guo Yonghuan, Yuan Jianmin. (2014). Finite element analysis of SnAgCu (Zn, Co, Fe) lead-free solder joints for electronic packaging. International Journal of Nonlinear Sciences and Numerical Simulation, 15(3-4):197-206.(SCI、EI)
7. Zhang Liang, Guo Yonghuan, He Chengwen. (2014). Reliability of lead-free solder joints in CSP device under thermal cycling. Journal of Materials Science: Materials in Electronics, 25(3):1209-1213.(SCI、EI)
8. Zhang Liang, Han Jiguang , Guo Yonghuan, He Chengwen. (2014). Anand model and FEM analysis of SnAgCuZn lead-free solder joints in Wafer Level Chip Scale Packaging devices. Microelectronics Reliability, 54(1):281-286.(SCI、EI)
9. Zhang Liang, Tian Lei, Guo Yonghuan, Sun Lei, Min Yong. (2014). Wettability of SnCuNi-xEu solders and mechanical properties of solder joints. Journal of Rare Earths, 32(12):1184-1188.
10. Zhang Liang, Sun Lei, Han Jiguang, Guo Yonghuan. (2015). Wettability optimization analysis of lead-free solders with Taguchi method. Journal of Materials Science: Materials in Electronics, 26(4):2605-2608. (SCI、EI)
11. Zhang Liang, Han Jiguang, Guo Yonghuan, Sun Lei. (2015). Creep behavior of SnAgCu solders containing nano-Al particles. Journal of Materials Science: Materials in Electronics, 26(6):3615-3620. (SCI、EI)
12. Zhang Liang, Sun Lei, Han Jiguang, Guo Yonghuan. (2015). Sizes effect of CeSn3 on the whiskers growth of SnAgCuCe solder joints in electronic packaging. Journal of Materials Science: Materials in Electronics, 26(8)：6194-6197. (SCI、EI)
13. Zhang Liang, Sun Lei, Guo Yonghuan. (2015). Microstructures and properties of Sn58Bi, Sn35Bi0.3Ag, Sn35Bi1.0Ag solder and solder joints. Journal of Materials Science: Materials in Electronics, 26(10):7629-7634. (SCI、EI)
14. Zhang Liang, Guo Yonghuan, Sun Lei, He Chengwen. (2016). Reliability of SnAgCuFe solder joints in WLCSP30 device. Rare Metal Materials and Engineering, 45(11):2823-2826. (SCI、EI)
15. Zhang Liang, Yang Fan, Zhong Sujuan. (2016). Whisker growth on SnAgCu-xPr solders in electronic packaging. Journal of Materials Science: Materials in Electronics, 27(6):5618-5621. (SCI、EI)
16. Zhang Liang, Yang Fan. (2016). New discovery of ZnO whisker in SnZn/Cu solder joints interconnection in concentrator silicon solar cells solder layer. Materials Letters, 171:154-157. (SCI、EI)
17. Zhang Liang, Yang Fan, Zhong Sujuan. (2016). Effect of Nd on whiskers growth behavior of SnAgCu solders in electronic packaging. Journal of Materials Science: Materials in Electronics, 27(9):9584-9588.(SCI、EI)
18. Zhang Liang, Liu Zhiquan, Yang Fan, Zhong Sujuan. (2017). Cu/SnAgCu/Cu bonding with different thickness for 3D IC. Soldering & Surface Mount Technology, 29(3):151-155. (SCI、EI)
19. Zhang Liang, Liu Zhiquan, Yang Fan, Zhong Sujuan. (2017). Cu6Sn5 whiskers precipitated in Sn3.0Ag0.5Cu/Cu interconnection in concentrator silicon solar cells solder layer. Materials, 10(4):327. (SCI、EI)
Honors and Awards
1. Jiangsu Innovative and EntrepreneurialDoctor. 2016
2. “Jiangsu Six Talent Peaks” High-level Talent. 2016
3. Jiangsu Innovation Project Young and Mid-aged Academic Leader. 2016
4. Second Prize, Huaihai Science & Technology Award. 2016
5. Second Prize, University Scientific Research Outstanding Achievement. 2014
6. Jiangsu Excellent Doctoral Dissertation. 2012
7. Third Prize, Jiangsu Science & Technology Progress Award. 2008
Contact Information
Email: zhangliang@jsnu.edu.cn